Sirius™ semiconductor diffusion furnaces
 
PRO 150: 4-stack furnace system for wafers up to 150mm dia.
PRO 200: 3-stack furnace system for wafers up to 200mm dia.
PRO 300: 2-stack furnace system for wafers up to 300mm dia.
 
 
  • Compact—only 4.2 m² (45.9 ft²) in clean room
  • PC controls at each tube level for functional capability
  • Windows® based operating system for ease of use
  • Host computer with touch-screen controls
  • Available with atmospheric, LPCVD and PECVD processing capability
  • Film unformities on many processes comparable with vertical furnaces at less than 1/3 the cost
See system
outline drawing		   You can view and print a 4-page brochure on the PRO Furnace Systems using Adobe Acrobat Reader.
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Add-ons for Sirius™ semiconductor furnaces

The following optional items may be ordered with the Sirius™ furnace system or added later to enhance system capability
 
• Controller Upgrade: Includes new process, temperature, gas system and loader controllers and host computer.
 
• Coil Sag Detector System: Allows heating elements to be replaced before potential damage to SiC process tubes.
 
• Hydrogen Burn-off System: May be installed in the scavenger exhaust to eliminate the possibilty of excess hydrogen escaping into the central exhaust system.
 
• External Torch Assembly: Produces wet O2 oxidation without adversely affecting the furnace temperature profile or the leading wafers in the boat.