Sirius™ semiconductor diffusion furnaces

Overview
 
PRO 150: 4-stack furnace system for wafers up to 150mm dia.
PRO 200: 3-stack furnace system for wafers up to 200mm dia.
PRO 300: 2-stack furnace system for wafers up to 300mm dia.
 
• Compact—only 4.2 m² (45.9 ft²) in clean room
• Each tube level microprocessor controlled for functional capability and ease of operation
• Windows® based operating system for ease of use
• Host computer with flat screen and keyboard/mouse controls (touch-screen available).
• Available with atmospheric, LPCVD and PECVD processing capability
• Film unformities on many processes comparable with vertical furnaces at less than 1/3 the cost
 
Sirius technical detail
The PECVD process
Download system outline drawing (pdf)
Download brochure on the PRO Furnace Systems (pdf)
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Add-ons for Sirius™ semiconductor furnaces

The following optional items may be ordered with the Sirius™ furnace system or added later to enhance system capability
 
• Coil Sag Detector System: Allows heating elements to be replaced before potential damage to SiC process tubes.
 
• Hydrogen Burn-off System: May be installed in the scavenger exhaust to eliminate the possibilty of excess hydrogen escaping into the central exhaust system.
 
• External Torch Assembly: Produces wet O2 oxidation without adversely affecting the furnace temperature profile or the leading wafers in the boat.