|
| The POCl3 Process |
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| POC33 boats are configured
to hold 380 substrates per run (two 95-slot boats with double wide slots for
running substrates back-to-back in each slot). |
| |
| Process Steps |
|
| 1. Load and temperature
stabilization |
8 – 10 minutes |
| |
|
| 2. Oxide (SiO2) layer (a
very thin oxide layer to protect substrate from chlorine in
POCl3) |
3 – 5 minutes |
| |
|
| 3. POCl3 deposition |
7 – 8 minutes |
| |
|
4. POCl3 and nitrogen purge (to remove
POCl3 fumes
from process tube) |
4 – 5 minutes |
| |
|
| 5. Unload |
8 – 10 minutes |
| |
|
| Total process time |
30 – 38 minutes |
| |
|
Process tube cleaning
The
process tube may be cleaned in the furnace by running steam through the tube at
the process temperature for approximately 5 minutes. This clean cycle typically
needs to be done every 1 – 3 days depending upon usage of system. A steam
generator is included with each POCl3 tube level.
Process
guarantee
3 consecutive runs at ±2% resistivity uniformity, 1
sigma within wafer, wafer-to-wafer, boat-to-boat, run-to-run. This is a process
guarantee; actual values typically are significantly better. |
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